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Next-Gen iPhone Components List Revealed, Includes 3.2MP Camera

April 14, 2009

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DigiTimes is back at it again, the Taiwanese rumor site has just published a list of who they believe will be some of the component suppliers for the next-generation iPhone that is rumored to launch this June. The list isn't too surprising, at least for those keeping track of past component rumors for the next-gen iPhone.  DigiTimes had actually recently reported that Samsung would be supplying the NAND flash chips, and they also reported that OmniVision would be supplying the 3.2MP CMOS image sensors, so nothing new here.  The list also indicates that Apple has decided to once again use Infineon's GPS and Baseband chips, the same company that supplied Apple with the chips for the previous iPhones. DigiTimes claims that Apple will be receiving shipments of the new iPhones as early as May, "with the first batch estimated to be around five million units." As always with any rumors concerning the iPhone, take them for what they are, simply rumors. [via Engadget]

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